Hình ảnh, tưởng tượng | Phần chính # / Nhà sản xuất | Mô tả / PDF | Số lượng / RFQ |
---|---|---|---|
Aavid, Thermal Division of Boyd Corporation |
INSULATOR CIRCULAR GEN PURP. Thermal Interface Products Mica Insulator for DO-5 |
584873chiếc |
|
Aavid, Thermal Division of Boyd Corporation |
MOUNT RECT IC 14DIP 0.050. Heat Sinks Semiconductor Mounting Pad, Rectangular, Dialyl Phthalate (DAP), Integrated Circuits, 14-DIP, 19.05x11.43x1.28mm |
120362chiếc |
|
Aavid, Thermal Division of Boyd Corporation |
MOUNT CIRCULAR TO5 0.075. Heat Sinks Semiconductor Mounting Pad for TO-11, 4 Leads, 1.91mm Thickness |
666106chiếc |
|
Aavid, Thermal Division of Boyd Corporation |
INSULATOR CIRCULAR GEN PURP. |
388377chiếc |
|
Aavid, Thermal Division of Boyd Corporation |
MOUNT CIRCULAR TO18 0.180. |
790543chiếc |
|
Aavid, Thermal Division of Boyd Corporation |
MOUNT CIRCULAR TO5 0.075. Heat Sinks Semiconductor Mounting Pad for TO-5, 3 Leads, 1.91mm Thickness |
808309chiếc |
|
Aavid, Thermal Division of Boyd Corporation |
MOUNT CIRCULAR TO18 0.120. |
749369chiếc |
|
Aavid, Thermal Division of Boyd Corporation |
MOUNT CIRCULAR TO5 0.125. |
773543chiếc |
|
Aavid, Thermal Division of Boyd Corporation |
MOUNT CIRCULAR TO5 0.020. Heat Sinks Semiconductor Mounting Pad for TO-5, Circular, Dialyl Phthalate (DAP), 0.51x8.89mm |
355323chiếc |
|
Aavid, Thermal Division of Boyd Corporation |
HEATSINK. Thermal Interface Products Semiconductor Mounting Pad for TO-18, Nylon, 4 Leads, 6.35mm OD, 0.97mm Thickness |
149298chiếc |
|
Aavid, Thermal Division of Boyd Corporation |
MOUNT CIRCULAR GEN PURP 0.070. Heat Sinks Semiconductor Mounting Pad, Circular, Dialyl Phthalate (DAP), 1.78x9.27mm |
201206chiếc |
|
Aavid, Thermal Division of Boyd Corporation |
HEATSINK. Heat Sinks Semiconductor Mounting Pad for TO-18, Circular |
168400chiếc |
|
Aavid, Thermal Division of Boyd Corporation |
MOUNT CIRCULAR TO5 0.046. |
719394chiếc |
|
Aavid, Thermal Division of Boyd Corporation |
MOUNT CIRCULAR TO5 0.075. |
685138chiếc |
|
Aavid, Thermal Division of Boyd Corporation |
HEATSINK. Heat Sinks Semiconductor Mounting Pad for Integrated Circuits, Nylon, 8 Leads, 12.70mm OD, 6.99mm Thickness |
100000chiếc |
|
Aavid, Thermal Division of Boyd Corporation |
INSULATOR CIRC GEN PURP 0.002. |
566452chiếc |
|
Aavid, Thermal Division of Boyd Corporation |
MOUNT CIRCULAR TO18 0.130. |
201814chiếc |
|
Aavid, Thermal Division of Boyd Corporation |
HEATSINK. Heat Sinks Semiconductor Mounting Pad, Circular, Dialyl Phthalate (DAP), 1.91x9.53x5.08mm |
92907chiếc |
|
Aavid, Thermal Division of Boyd Corporation |
MOUNT CIRCULAR GEN PURP 0.275. |
273774chiếc |
|
Aavid, Thermal Division of Boyd Corporation |
MOUNT CIRCULAR GEN PURP 0.075. |
266139chiếc |